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Keteca Diamaflow™ - dicing solutions and surfactants

The world’s market leader in the category, Diamaflow™ dicing solutions are formulated to prevent corrosion and to solve the problem of dust adhering on semiconductor wafers during the die separation process. Formulated using several special precision cleaning, surface-active, non-ionic surfactants – each selected for a specific purpose – these dicing solutions are introduced to the dicing water via our own Diamaflow™ Automatic Dispensing Systems.

Keteca Diamablade™

This breakthrough product by Keteca features superior blade quality – a strong blade with extended blade life and improved diamond exposure. This translates to better cut quality, improved kerf width and reduced chipping.

Keteca Diamaflow
Keteca Diamablade