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Keteca Diamaflow™ Dicing Solutions & Surfactants

Keteca Diamaflow™ Dicing Solutions

As the semiconductor technology rapidly advances, wafer size is increased, while die size is reduced. This prolongs the time spent for dicing, which leads to some challenges:

Increased wafer dust particles

Adhere to wafer surface
Accumulate in bonding pads and trenched locations
Difficult to remove in subsequent cleaning processes once in contact with wafer
Virtually impossible to remove once trapped in deep trenches or crevices (commonly found in MEMs devices)


Increased corrosion on Al/Cu bonding pads

Increased duration of exposure to liquids for corrosion to occur
Dust particles with copper content in contact with Al/Cu bonding pads promotes galvanic corrosion
Corrosion and pitting causes permanent damage to bonding pads
Lead to poor bonding performance, poor reliability or even failure of the device.

In today's competitive semiconductor industry, maximizing yield and productivity is of pivotal importance. Keteca Diamaflow™ dicing solutions and Diamaflow™ dispensing systems provide improved methods to ensure cleaner wafers and to reduce corrosion on bonding pads. This results in higher die yields per wafer.
 

 
Effectiveness of Keteca Diamaflow™

On wafer saw dust:

Without Diamaflow™
With Diamaflow™
Without Diamaflow™
With Diamaflow™


On corrosion:

Without Diamaflow™
................................................................................................
With Diamaflow™
 

How does Diamaflow™ work?

Diamaflow™ is mixed with D.I. water in our dispensing systems and the mixture is fed into saw machines through the regular D.I. water lines.
 
Diamaflow™ dicing solutions enhances the wetting and lubricity characteristics of D.I. water. Diamaflow™ reduces the water surface tension by more than 50%. This reduces the amount of dry spots on the wafer during sawing and prevents direct contact between wafer dust and the wafer.

Effect of Diamaflow™ during sawing

Without Diamaflow™
With Diamaflow™
................................................................................................
Wetting Action of Diamaflow™ during sawing operation

D.I. Water (plus CO2) w/o Diamaflow™
Surface Tension : 72 dynes/cm
D.I. Water (plus CO2) with Diamaflow™
Surface Tension : 31 dynes/cm


When Diamaflow™ molecules adhere to the dust particle, the contact angle between the particle and the surface increases. The dust particle is eventually removed from the surface as more Diamaflow™ molecules are attached to it. While the lipohilic molecules attach themselves to the particle, the hydrophilic (water loving) tails suspended the particle in the water solution. This allows the particle to be washed away with ease.

This significantly reduces wafer and bonding pad surface contamination resulting from dicing.

 

 
Other advantages

Enhance cut quality and extend blade life

The Diamaflow™/D.I. water mixture has a reduced water tension which allows it to seep and flow easily into the kerf. Newly generated dust particles are quickly wet and are easily removed from the cutting area. This leads to a reduction in friction generated during dicing. With less loading on the blade, the cut quality is enhanced with reduced chipping and the lifetime of the dicing blade can be extended.

Increase cutting speed

With increased lubricity and less loading on the blade, it allows the feed rate to be increased. This translates to an increase in wafer saw throughput.